We offer a wide variety of ball, wedge and stud bonding wires. Available in a range of purities. All our Gold alloy bonding wires are corrosion resistant and have a homogeneous chemical composition and stable mechanical properties.

Ball Bonding Gold Wires We offer a range of bonding wires to suit your requirements, sorted into three major classifications, we can supply the right wire for any ball bond application. These major categories take into account mechanical strength, and looping requirements.

Stud Bumping Gold Wires Specially developed gold wires are available for all applications including Standard Stud, Coined, and Stacked Bumps. Our wires deliver consistent bump height and long-term bond stability.

Wedge Bonding Gold Wires Our wedge bonding wires are designed to produce low, consistent loop profiles achieving consistent impedance in high frequency applications. 

High purity fine aluminium alloy bonding wires offer a fantastic way to keep your costs under control. The Heraeus manufactured small diameter wires are made from high quality 99% aluminium and 1% silicon. Engineered for use in motor vehicles and electronics, these wires are best for signal transmission and processing. Providing a cost savvy way to create effective bonds at room temperature, these wires are perfect for creating high integrity bonds and help prevent damage to sensitive devices.

Available in three different hardness grades and providing excellent electrical and thermal conductivity, these wires are suitable for a wide range of wedge bonding applications.

We offer a range of precious and non-precious Heraeus manufactured fine bonding ribbons. These ribbons are available in gold, silver, platinum and copper, other materials are available upon request.

Gold bonding ribbons are specifically engineered for high reliability in many applications, including microwave devices and high frequency applications. They take advantage of the “skin effect”, when using high frequency signals, most of the flow is on the surface.

Exacting manufacturing specifications produce bonding ribbons that have a homogeneous composition, stable mechanical properties, smooth surfaces and consistent widths, insuring a minimizing of snagging in bonding.

The ribbons we supply start life as 99.99% pure aluminium. Doping with carefully controlled additives allows for high purity, while production ribbons that exhibit precise dimensions, exacting mechanical characteristics and looping behaviour.

Heraeus manufactured heavy aluminium bonding wires and ribbons are engineered for a variety of purposes and provide excellent power delivery. Our aluminium wire offers double the current carrying capabilities of cooper per gram and are highly reliable and provide excellent performance.

We offer a full range of high purity heavy wires which are suitable for low current applications, while the large cross section ribbons are perfect for high power transmission.

Available in extra-long lengths and offering a wide range of types, Heraeus High purity wires and ribbons offer a wide bonding process window, while providing reliability for your electronics.

Our Heraeus manufactured copper core aluminium is marketed as CucorAl. It is a composite wire featuring a high quality copper core with an aluminium outer shell. The mix of the two metals provides excellent electrical transfer while maintaining mechanical properties.

With a copper core comprising 50 percent of the volume, good bonding is achieved thanks to the softness of the aluminium, while the copper produces excellent electrical, thermal and mechanical properties. Cooper core aluminium wire can be used with traditional aluminium bonding equipment, provides a reliable bonding window, without changes to the chip metallization.

Engineered to withstand high power density and switching frequencies, while operating at high temperatures (up to 200c), and providing lasting reliability, up to 5 times that of aluminium.